Senior Server Liquid Cooling Thermal Design Engineer

About Asiacruit

At Asiacruit, we connect top talent with forwardthinking organizations across industries. Our mission is to help businesses grow through smart, strategic, and peoplefocused solutions. We are expanding our highperformance computing and data center solutions practice and seek a Senior Server Liquid Cooling Thermal Design Engineer to join our engineering team supporting nextgeneration server platforms and liquidcooled data center deployments.

Position Overview

We are seeking an experienced engineer with deep expertise in thermal systems, liquid cooling architectures, and server thermal/mechanical integration. The role requires handson design, analysis, validation, and crossfunctional collaboration to deliver reliable, manufacturable thermal solutions for rackscale and hyperscale server products. You will drive thermal architecture decisions, lead thermal simulation and testing, and partner closely with electrical, mechanical, firmware, reliability, and manufacturing teams to ensure product performance, reliability, and serviceability.

Key Responsibilities

Cold Plates & Component Cooling

• Lead the endtoend design of liquidcooling cold plates for GPUs, highpower CPUs, and AI accelerator chips used in servers.
• Address chiplevel high heat flux density and transient power spikes through microchannel, jet impingement, and manifold flow topology optimization, heatspreading structure design, TIM selection, and lightweight structural design.
• Perform simulation and optimization to resolve nonuniform flow distribution and localized overheating within cold plates.
  
  

System Architecture & Integration

• Lead thermal architecture and design for server and racklevel liquid cooling solutions, including cold plates, manifolds/coolant distribution systems, heat exchangers, and coolant selection.
• Own the interface and compatibility between liquidcooling heat sinks and the overall server thermal system, ensuring performance compatibility with CDUs, piping, and quickconnect fittings.
• Develop and validate thermal models for CPUs, GPUs, memory, power delivery, and other highpower components; translate component heat maps into systemlevel cooling strategies.
  
  

Modeling, Simulation & Analysis

• Utilize CFD and thermal simulation toolse.g., ANSYS Icepak, STARCCM+, Siemens Simcenterto conduct steadystate and transient thermal analyses, including singlephase and twophase coupled simulations.
• Apply FEA where appropriate for structural/thermal coupling and conduct parametric optimization.
  
  

Validation & Testing

• Define performance test plans for liquidcooling heat sinks (e.g., thermal resistance, pressure drop), design/build test rigs, and lead lab characterization (flow, leakage, vibration, reliability).
• Execute tests and analyze data to iterate designs; support massproduction issue troubleshooting and solution development.
  
  

CrossFunctional Execution

• Collaborate with mechanical design and manufacturing to meet structural, DFMA, serviceability, and cost targets.
• Work with electrical and firmware teams on thermal control strategies, sensors, and closedloop cooling algorithms; support software validation and tuning.
• Author and maintain technical documentation: thermal requirements, test procedures, DVPs, risk assessments, and change records.
  
  

Quality, Reliability & Leadership

• Drive DFx (test, assembly, service) and reliabilitybydesign practices; lead FMEA and implement mitigations.
• Partner with suppliers/CMs to qualify components (cold plates, seals, fittings, tubing, pumps), evaluate proposals, and support procurement decisions.
• Provide technical leadership and mentorship to junior engineers; contribute to project planning and design reviews.
  
  

Qualifications 2) Professional Experience3) Core Competencies(b) Simulation Capability4) Technical Skills & Tools5) Behavioral CompetenciesPreferred QualificationsWhy Join AsiacruitHow to Apply

• Education
• Master's degree or above in Engineering Thermophysics, Thermal Engineering, Mechanical Engineering, Fluid Mechanics, or related disciplines. (Exceptional Bachelor's candidates may be considered with strong, directly relevant experience.)
• Minimum 6 years in thermal design, including at least 2 years focused on liquidcooling heat sinks for servers (component and/or system level).
• Proven experience delivering production hardware through design, validation, and transfertomanufacturing.
• For module lead positions, team leadership and people management capabilities are required.
• Design Capability
• Proficient in 3D CAD tools such as SolidWorks, CREO, CATIA; able to independently complete complex coldplate structural design, engineering drawings, and tolerance analysis.
• Experience in liquidcooling hardware: cold plates, microchannels, manifolds, seal technologies, quickconnect fittings, pumps, and system integration.
• Highly proficient in at least one mainstream CFD/thermal simulation tool (e.g., ANSYS Icepak, STARCCM+, Siemens Simcenter); handson with conjugate heat transfer, transient thermal analysis, and parametric optimization.
• Familiarity with FEA for structural/thermal coupling is a plus.
• Handson with test equipment & DAQ: flow benches, pressure sensors, thermal chambers, IR thermography, instrumentation.
• Working knowledge of materials, corrosion/compatibility for coolants, and contamination control for liquidcooled electronics.
• Proficient producing/reviewing BOMs and manufacturing documentation.
• Familiarity with thermal control strategies and sensor integration; ability to collaborate with firmware/embedded teams.
• Analytical & Problem Solving: Strong physicsbased reasoning; ability to translate complex thermal interactions into actionable design changes.
• Handson Validation: Designs experiments, operates lab equipment, and qualifies hardware to thermal/reliability targets.
• Crossfunctional Collaboration: Works effectively with EE, ME, FW, Reliability, Operations, and suppliers.
• Design for Manufacturing & Reliability: Applies DFMA/DFMEA; designs for serviceability and highvolume production.
• Project Leadership: Leads technical workstreams, prioritizes, manages risks, and mentors junior engineers.
• Communication: Strong written/verbal communication; produces clear reports and presents findings to stakeholders.
• Experience with racklevel liquid cooling, reardoor heat exchangers, or immersion cooling.
• Prior work on hyperscale/enterprise servers, HPC, or telecom equipment.
• Familiarity with regulatory and safety standards for liquidcooled electronic equipment.
• Advanced degree in thermal/fluids or publications/patents in thermal management.
• Flexible and remote work options supporting worklife balance; onsite lab access for testing/validation as required.
• Collaborative, diverse team delivering cuttingedge cooling solutions for global clients and cloud providers.
• Professional growth, ongoing training, and support for advanced degrees/certifications.
• Competitive compensation, benefits, and performance incentives aligned with industry standards.
• A culture that values engineering excellence, continuous improvement, and inclusive teamwork.
  
  

Ready to advance liquid cooling for nextgeneration servers Apply at https://asiacruit.com or email [Confidential Information] with the subject line:

Senior Server Liquid Cooling Thermal Design Engineer [Your Name]

Please include your resume, portfolio of relevant work (design packages, test reports, publications), and references.