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Position Overview
Design and develop advanced optoelectronic devices-including FP lasers, DFB lasers, EMLs and external cavity laser modules-to meet performance and product requirements. This role involves building test setups and characterization capabilities aligned with the company's technology roadmap and integrating these capabilities into in-house manufacturing processes.
Responsibilities
Requirements
Job ID: 148293999
Skills:
3d packaging , process qualification , thermal management , vision systems, semiconductor process characterization, failure analysis workflows, yield analysis, 2.5D Packaging, Flip Chip, Spc, CoWoS, Advanced Packaging, HBM, statistical analysis tools, Chiplet Integration, Doe, alignment systems, warpage control
Skills:
C, test automation, MATLAB, Microsoft Excel, Scripting, Python, LabVIEW, Data Analysis, Statistical Tools, Jmp, FPGA design and development, optoelectronic testing, optical test equipment
Skills:
PostgreSQL, Spring Boot, React, Typescript, Docker, Python, AWS, Java, Graphql, Dynamodb, Jwt, Kotlin, Redis, New Relic, React, FastAPI, Anthropic Claude, AWS Bedrock, Google Gemini, OpenAI GPT-4, LangChain, Auth0, ElastiCache, Zilliz Milvus, GitLab CI
Skills:
Elk, Linux System Administration, Prometheus, Grafana, Pulumi, Python Scripting, Terraform, Ansible, Sonarqube, Helm, Kubernetes, Snyk, GitLab CI, OpenTelemetry, ArgoCD
Skills:
Elk, Prometheus, Bash, Networking, Grafana, Datadog, Linux Administration, Jenkins, Gcp, Docker, Terraform, Ansible, Distributed Systems, Helm, Azure, Kubernetes, Python, AWS, Go, EFK, GitHub Actions, ArgoCD
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