3d packaging , process qualification , thermal management , vision systems, semiconductor process characterization, failure analysis workflows, yield analysis, 2.5D Packaging, Flip Chip, Spc, CoWoS, Advanced Packaging, HBM, statistical analysis tools, Chiplet Integration, Doe, alignment systems, warpage control

C, test automation, MATLAB, Microsoft Excel, Scripting, Python, LabVIEW, Data Analysis, Statistical Tools, Jmp, FPGA design and development, optoelectronic testing, optical test equipment

PostgreSQL, Spring Boot, React, Typescript, Docker, Python, AWS, Java, Graphql, Dynamodb, Jwt, Kotlin, Redis, New Relic, React, FastAPI, Anthropic Claude, AWS Bedrock, Google Gemini, OpenAI GPT-4, LangChain, Auth0, ElastiCache, Zilliz Milvus, GitLab CI

Elk, Linux System Administration, Prometheus, Grafana, Pulumi, Python Scripting, Terraform, Ansible, Sonarqube, Helm, Kubernetes, Snyk, GitLab CI, OpenTelemetry, ArgoCD

Elk, Prometheus, Bash, Networking, Grafana, Datadog, Linux Administration, Jenkins, Gcp, Docker, Terraform, Ansible, Distributed Systems, Helm, Azure, Kubernetes, Python, AWS, Go, EFK, GitHub Actions, ArgoCD

Java, Hadoop, Scala, Sql, Git, Azure Data Factory, Gcp, Docker, Terraform, Spark, Databricks, Azure, Python, AWS, Airflow, infrastructure-as-code