Senior Engineer I -Process

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Job Description:

Backend Process Engineer owns the wafer dicing/singulation process to meet yield, quality, cost, and output targets. The role is accountable for process stability (SPC), equipment capability, blade/consumables optimization, and rapid problem-solving for saw-related defects.

Job Description:

Establish, maintain, and improve saw process parameters (feed rate, spindle speed, blade exposure, cut depth, coolant flow, dressing) to hit quality metrics (chipping, kerf width, die strength)

Implement and monitor SPC charts for critical parameters and outputs trigger and lead containment and corrective actions for OOC/OOS signals

Define golden sample criteria, cut recipes, and recipe management controls

Analyze yield loss and defect paretos (edge chipping, front/backside chipping, edge crack, burrs, delamination, blade loading, overheating)

Lead structured problem solving (5-Why, Ishikawa, DMAIC), run DOEs, and implement sustainable corrective/preventive actions

Drive blade selection and life optimization manage kerf control and saw mark quality

Collaborate with equipment engineers for uptime/OEE improvement, PM optimization, and capability enhancement

Qualify new blades, hubs, coolants, and dressers manage vendor trials and cost-per-cut optimization

Requirements/Qualifications:

• Minimum of 5 years experience in semiconductor wafer dicing/saw process, backend assembly, or related manufacturing environment
• Understanding of wafer saw/dicing equipment operations (DISCO, ADT, or equivalent)
• Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
• Understanding of blade characteristics (grit, bond, concentration) and their impact on performance
• Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
• Strong analytical and problem-solving skills ability to interpret SPC charts and process data.
• Good communication skills and ability to work in a team-oriented environment.
• Knowledge of safety protocols and cleanroom practices.
• Strong experience with WLCSP or advanced packaging tools is highly preferred
• Proficiency in MS Office and maintenance management systems.
• Strong analytical and problem-solving skills
• Leadership and mentoring capability
• Good communication and teamwork skills
• High attention to detail and sense of accountability