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People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the
Aggregate System and it's won us countless awards for diversity and workplace excellence.
Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you.
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Job Description:
Backend Process Engineer owns the wafer dicing/singulation process to meet yield, quality, cost, and output targets. The role is accountable for process stability (SPC), equipment capability, blade/consumables optimization, and rapid problem-solving for saw-related defects.
Job Description:
Establish, maintain, and improve saw process parameters (feed rate, spindle speed, blade exposure, cut depth, coolant flow, dressing) to hit quality metrics (chipping, kerf width, die strength)
Implement and monitor SPC charts for critical parameters and outputs; trigger and lead containment and corrective actions for OOC/OOS signals
Define golden sample criteria, cut recipes, and recipe management controls
Analyze yield loss and defect paretos (edge chipping, front/backside chipping, edge crack, burrs, delamination, blade loading, overheating)
Lead structured problem solving (5-Why, Ishikawa, DMAIC), run DOEs, and implement sustainable corrective/preventive actions
Drive blade selection and life optimization; manage kerf control and saw mark quality
Collaborate with equipment engineers for uptime/OEE improvement, PM optimization, and capability enhancement
Qualify new blades, hubs, coolants, and dressers; manage vendor trials and cost-per-cut optimization
Requirements/Qualifications:
- Minimum of 5 years experience in semiconductor wafer dicing/saw process, backend assembly, or related manufacturing environment
- Understanding of wafer saw/dicing equipment operations (DISCO, ADT, or equivalent)
- Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
- Understanding of blade characteristics (grit, bond, concentration) and their impact on performance
- Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
- Strong analytical and problem-solving skills; ability to interpret SPC charts and process data.
- Good communication skills and ability to work in a team-oriented environment.
- Knowledge of safety protocols and cleanroom practices.
- Strong experience with WLCSP or advanced packaging tools is highly preferred
- Proficiency in MS Office and maintenance management systems.
- Strong analytical and problem-solving skills
- Leadership and mentoring capability
- Good communication and teamwork skills
- High attention to detail and sense of accountability
Travel Time:
0% - 25%
To all recruitment agencies:
Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.
