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Equipment Engineer (SMT, Wirebond or Die Attach)

Equipment Engineer (SMT, Wirebond or Die Attach)

integrated micro-electronics, inc. (imi global)
2-4 Years
Not Disclosed
  • Posted 11 hours ago
  • Be among the first 10 applicants

Job Description

Qualifications:

  • Graduate of any Engineering course
  • With at least 2-4 years of experience in machine maintenance and equipment engineering within a semiconductor manufacturing environment
  • Preferably with experience in any of the following machines: SMT, Wirebond or Die attach
  • Strong knowledge of preventive, corrective, and predictive maintenance activities
  • Familiarity with machine calibration, process optimization, and equipment reliability improvement
  • Willing to work on Biñan, Laguna

Key Responsibilities:

  • Perform preventive and corrective maintenance of production equipment to ensure optimum machine performance
  • Troubleshoot equipment issues and implement effective solutions to minimize downtime
  • Monitor equipment health and drive continuous improvement initiatives
  • Support equipment installation, qualification, and process conversion activities
  • Coordinate with Production, Process Engineering, and Quality teams to achieve operational targets
  • Prepare maintenance reports, machine documentation, and service records
  • Ensure compliance with company safety, quality, and operational standards

More Info

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Key Skills

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