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Process Engineer (Wirebond or Die Attach)

Process Engineer (Wirebond or Die Attach)

integrated micro-electronics, inc. (imi global)
2-4 Years
Not Disclosed
  • Posted 11 hours ago
  • Be among the first 10 applicants

Job Description


Qualifications:

  • Graduate of any Engineering course
  • With 2-4 years of relevant experience in Process Engineering or New Product Introduction (NPI)
  • Strong background in Wirebond or Die Attach
  • Knowledgeable in process development, process optimization, yield improvement, and continuous improvement initiatives
  • Strong analytical, communication, and interpersonal skills
  • Willing to work in Biñan, Laguna

Key Responsibilities:

  • Develop, implement, and optimize manufacturing processes to improve quality, yield, and productivity.
  • Support NPI activities from process qualification through production ramp-up.
  • Lead continuous improvement projects focused on quality, cost reduction, and operational efficiency.
  • Prepare and maintain process documentation, work instructions, and technical reports.

More Info

Job Type:
Industry:
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Key Skills

Wirebond

Yield improvement

Continuous improvement initiatives

New Product Introduction (NPI)