Process Engineer (Wirebond or Die Attach)
Process Engineer (Wirebond or Die Attach)
integrated micro-electronics, inc. (imi global)- Posted 11 hours ago
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Job Description
Qualifications:
- Graduate of any Engineering course
- With 2-4 years of relevant experience in Process Engineering or New Product Introduction (NPI)
- Strong background in Wirebond or Die Attach
- Knowledgeable in process development, process optimization, yield improvement, and continuous improvement initiatives
- Strong analytical, communication, and interpersonal skills
- Willing to work in Biñan, Laguna
Key Responsibilities:
- Develop, implement, and optimize manufacturing processes to improve quality, yield, and productivity.
- Support NPI activities from process qualification through production ramp-up.
- Lead continuous improvement projects focused on quality, cost reduction, and operational efficiency.
- Prepare and maintain process documentation, work instructions, and technical reports.
More Info
Key Skills
Wirebond
Yield improvement
Continuous improvement initiatives
New Product Introduction (NPI)
