Work with subcontractors on Assembly Processes Characterization. Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.
Review or generate Process specs and other documents, follow up review and approval by different teams within the organization.
Work with Subcontractors in designing and improving leadframe, BOM.
Work with Subcontractors on NRE tooling quote, PO release and delivery.
Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds.
Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.
Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related).
Lead overall execution locally at Subcon side together with global team.
Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.
Qualifications
Required Qualifications
Basic
Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors.
Must be fluent in English in writing and speaking.
Must have at least 5 years process engineering experience in a Semiconductor backend facility.
Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.
Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.
Preferred
Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)
