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5-7 Years
SGD 6,000 - 8,000 per month
  • Posted a month ago
  • Be among the first 10 applicants

Job Description

Job responsibilities

  • Assembly and packaging process improvement and optimization in systematic manner
  • Documentation for key assembly and packaging processes, and implementation of effective process control practices to achieve repeatability of quality assembly process
  • Propose, evaluate and refine current process steps for yield and capacity improvements
  • Documentation and implementation of preventive and corrective action, and best-known methods to allow more efficient process troubleshooting
  • Qualification of new assembly and packaging related direct materials
  • Buyoff and release of new assembly and packaging equipment
  • Analyze process out of control and failures, and develop corrective actions accordingly
  • Monitor process performance and suggest improvements
  • Work with specialists/vendors to design and develop new process
  • Ensure compliance with ISO standards and support audit functions
  • Provide support for customer returns
  • Perform process qualification before handing off to production
  • Develop cost-reduction initiatives while still maintaining quality and productivity
  • Aligning and supporting packaging roadmaps, developing and optimizing processes to improve product quality and reliability
  • Working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems


Requirements

  • Degree in Mechanical Engineering / Material Science
  • Minimum 5 years working experience in semiconductor assembly and packaging process
  • Ideally with strong semiconductor assembly and packaging process experience and knowledge, deep understanding about processes such as wafer cleaving, die attachment (especially eutectic die attach), wire bonding, etc.
  • Strong skills in developing and refining process to enhance yield, reliability and efficiency, with vast hands-on experience in DOE (design of experiment) practice
  • Strong analytical skills to identify and resolve process issues effectively
  • Ability to develop long-term strategies for process improvement and innovation
  • Familiarity with industry standards and regulations related to semiconductor assembly and quality control
  • Ability to lead projects and work collaboratively with cross-functional teams
  • Able to mentor junior engineers and lead team in process improvement initiatives

More Info

Job Type:
Industry:
Employment Type:

Key Skills

die attachment

eutectic die attach

semiconductor assembly and packaging process

wafer cleaving

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