Education:
BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field
Work Experience:
- At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
- Prior exposure and work in a high-volume IC assembly production/factory is preferred
Preferred Skills:
- CAD software use (e.g. AutoCAD and Cadence APD)
- FEA modeling experience for thermal, mechanical and electrical package optimization
- Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
- Experience in strip testable package development
RESPONSIBILITIES:
- Identify suitable Panel Level and WLCSP (PLP) package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with material suppliers as well as design groups, product engineering, marketing and business units
- Manage qualification of new packages or changes to ensure quality and mitigate risk
- Initiate or assist with documentation creation, specifications and build instructions for PLP assembly
- Assist with global cost reduction, standardization and new system implementation projects
- Initiate and develop FMEA and other proactive reliability and process improvement flows
MANDATORY SKILLS:
- Ability to comprehend engineering drawings, design changes, and specifications.
- Subject Matter Expert on WLP and PLP technology and processes
- Superior communication and presentation skills as well as advanced project management
- Ability to solve problems and assist the reliability group on FA's on assembly related failures
- Ability to carry on multiple projects, set timelines and prioritize projects
- Competence in working with multiple databases, technical acronyms and complex data sets
- Subject matter expert on major process modules
- Proficient in material and process characterization
- Provide technical competitor analysis and review and review of new solutions
- Knowledgeable in data analysis, failure isolation, product and design information, device knowledge and deep understanding of our current technologies
- Provide technical guidance to junior level engineers.
