Responsibilities
- Ensure quality and integrity in the execution of Mold equipment engineering processes
- Oversee the installation, modification, upgrade, and maintenance of manufacturing equipment
- Stay current on equipment manufacturers technical notices, upgrades, and safety bulletins
- Analyze equipment performance and reliability trends
- Develop programs and solutions to increase uptime and resolve equipment issues affecting the manufacturing process
- Provide technical support to manufacturing equipment repair and process engineering teams
- Define and author preventive maintenance schedules
Qualifications
Minimum Requirements:
- Bachelor's degree in Electrical Engineering, Electrical & Computer Engineering, Chemical Engineering, Mechanical Engineering, Materials Science Engineering, Physics, or a related engineering discipline
- Minimum 5 years of relevant experience as an Equipment Engineer in a semiconductor manufacturing environment
Preferred Qualifications:
- 3–5 years of hands-on experience with Mold equipment
- Advanced setup, maintenance, and troubleshooting skills
- Ability to create work instructions, procedures, and critical machine specifications
- Knowledge of machine calibration processes
- Experience using handy panels and other calibration jigs
- Solid understanding of equipment and process parameters
- Working knowledge of material-to-machine integration
- Advanced chase tooling, balancing, and setup experience
- Strong DOE (Design of Experiments) and problem-solving skills
- Advanced proficiency in Excel, PowerPoint, SQL, Spotfire, or similar data collection/visualization tools
- Background in Mold Flow simulation
Nice to Have:
- Intermediate knowledge of the following equipment:
- Nordson / Panasonic Plasma
- Bake Oven
- CSAM / X-ray
- EO / Josung Laser
- Accretech / Disco Saw Singulation
