Principal Engineer, FE OCT CPEE ADT BOND

As a Bonding Process & Equipment Engineer at Micron Technology, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding).

You will drive yield improvement, cost reduction, process capability enhancement, and risk management, while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites.

Key Responsibilities

Process Development & Optimization

• Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration)

• Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

Yield & Reliability Improvement

• Lead yield enhancement initiatives by analyzing process, tool, and material interactions

• Perform systematic root cause analysis using methodologies such as DOE, FMEA, 8D, SPC, and fault isolation techniques

• Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions

Equipment & Materials Engineering

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platforms)

• Define equipment specifications, roadmap, process control strategies, and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

Technology Transfer & Process Integration

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration, CMP, WET, and Films teams to ensure cross-module compatibility

Manufacturing Support & Problem Solving

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time, tool availability, and cost efficiency

Qualification & Control

• Lead new process and baseline qualifications

• Develop control plans, SPC strategies, and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

Supplier & Cross-Functional Collaboration

• Partner with suppliers for technology development, process improvement, and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

Requirements:

• Bachelor's, Master's, or Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, or related field

• 7 years+ Relevant proven experience in semiconductor manufacturing or advanced packaging

• Strong knowledge of semiconductor bonding processes (wafer to wafer hybrid bonding, fusion bonding preferred)

• Understanding of Cu plating, CMP interaction, surface preparation, and defect mechanisms

• Experience with advanced packaging technologies (HBM, TSV, wafer-to-wafer bonding) is highly preferred

• Proficiency in data analysis, SPC, and statistical modeling

• Strong problem-solving skills using structured methodologies (8D, FMEA, DOE)

• Ability to manage complex projects involving multiple functions in a high-volume manufacturing environment

• Excellent communication and collaboration skills across global teams