Key Responsibilities and Duties
Design & Risk Assessment
- Initiates the internal assembly design of the GaN device, BOM & Process flow in a target package footprint
- Prepared preliminary Build diagram and Package Outline Drawings.
- Conducts risk assessment and identification of mitigating actions to eliminate or reduce the risks. This will be in collaboration with OSAT development team and Navitas Operations/NPI teams
- Works with Simulation engineer for thermal and thermo-mechanical stress simulations as part of risk assessment of new designs.
- Lead cross-functional team reviews to finalize proposed design
- Defines new assembly package layout rules as reference for future designs
Package Development
- Drives all assembly validation activities to freeze Design-, BOM- and Process-of-records
- Performs Learning Cycle builds to validate design and material selection versus target performance
- Works with Rel team to execute Look-ahead reliability evaluations and post-stress construction analysis to assess package robustness
- Oversees the assembly of Final POR Qualification Lots at OSAT up to delivery of samples for Reliability testing
- Compiles and provides all relevant documentation under Package Engineering deliverables as per Navitas New Product Development Process
Customer Support
- Generates Engineering build requests for customer samples requested by BU
- Monitors assembly CTQs and yield performance of customer sample lots for CPK and yield analysis
- Generates Application notes for new packages to provide guidance for optimum board mount conditions of Navitas products.
Qualifications
Required Qualifications
- Bachelors degree or MS degree in Semiconductor Engineering, Materials Science, Chemical Engineering or a related technical field.
- At least 15 years experience in Package design and development
- Strong understanding of power semiconductor device physics and manufacturing processes.
- Experience with SiC and/or GaN technologies preferred.
- Deep working knowledge of SPC, DOE, Cpk/Ppk analysis, FMEA, control plans, root-cause analysis, and yield analytics.
- Proven experience leading engineering projects and mentoring technical teams.
- Excellent communication skills with the ability to collaborate effectively across global, cross-functional organizations.
Preferred Qualifications
- Package design using 2D CAD
- Understanding of FEA simulation techniques, reliability qualification standards, failure-analysis methodologies, and process excursion management.
- Experience in new assembly technologies for advanced power devices (ie flipchip, clip attach, Ag sinter, etc)
- Experience in leading or coordinating geographically distributed engineering teams.
