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Engineer, Reliability Engineering
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About Analog Devices
Analog Devices, Inc. (NASDAQ: ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at and on and .
A Product Reliability Engineer (PRE) is responsible for the definition and execution of reliability stress test plans for new products, product revisions, manufacturing changes, and reliability monitoring. The Product Reliability Engineer leads root cause analysis of qualification failures and drives appropriate corrective and preventive actions using structured problem-solving methods.
Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or a related field
3-5 years relevant experience in Reliability Engineering, Test/Product Engineering, or Failure Analysis in the semiconductor industry.
Knowledgeable in automotive, aerospace, industrial, or high-reliability standards (AEC-Q100/Q101, JEDEC, MIL-STD, etc.) with strong foundation in electronics and semiconductor device physics
Knowledgeable in life test and environmental stress equipment knowledgeable in stress test conditions and procedures proven experience designing burn-in boards, life test boards, or reliability test schematics for silicon, packaged devices, or systems with ability to debug and validate burn-in or life test hardware using bench instrumentation (oscilloscopes, DMMs, SMUs, thermal sensors)
Knowledgeable in failure analysis techniques including physical analysis and electronic fault isolation ability to perform root cause analysis and connect FA results to device physics and process/design gaps has experience leading structured problem-solving teams using 8D or six sigma methodology
Proficient in reliability statistical calculations such as MTTF, MTBF, Weibull, FIT with experience analyzing large datasets using tools such as Python, JMP, MATLAB, or similar software.
Develop and execute qualification plans, reliability evaluations, and risk assessments
Perform reliability statistical calculations, such as MTTF, MTBF, FIT, and failure rate modeling
Lead structured problem-solving teams using six sigma, 8D methodologies
Communicate and interpret qualification requirements within a cross-functional environment.
Identify and plan for application specific mission profiles
Support internal/external customers with general reliability related inquiries.
Support continuous improvement initiatives in the department
Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X . Come join ADI - a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.
Job ID: 153382181
Skills:
Familiarity with industry standards MIL-STD-883 JESD-47 JESD-94 J-STD-020 AEC-Q100, Technical Writing, Project management, BS EE ECE Materials Physics or related field, industry experience in packaging wafer fabrication test design or device physics, independent research, Leading structured problem-solving teams using six sigma methodologies and 8D
Skills:
Reliability Engineering, Root Cause Analysis, Reliability test schematics, Life test and environmental stress equipment, Failure analysis techniques, Six Sigma Methodology, Failure Analysis, Test Product Engineering
Skills:
Test Engineering, PLC troubleshooting, ATP testing, Production data tracking tools, Process Engineering, Analyzing test data, Manufacturing Engineering, Validation activities, Engineering analysis tools, Product Engineering, Implementing corrective actions, Microsoft Office Applications, Manufacturing test processes, Improving FPY
Skills:
Lean Six Sigma Green Belt, Control Plans, Engineering Tools and Methodology, Procedures, Process Flows, Mechanical Relay assembly and test process, FMEAS
Skills:
preservatives , Analytical testing, Heat Transfer, Glp, Gmp, Batching, Haccp, Spc, Commissioning, iso standards, emulsions, Mixing, Six Sigma, Lean Manufacturing, Philippine regulatory requirements, Surfactant systems, Formulation Development, Doe, Sanitiser formulations, Process troubleshooting, Process Engineering
