Engineer I-Failure Analysis

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Job Description:

Performs detailed electrical and physical failure analysis for cutting edge products using non-destructive analytical tools (such as X-ray, Scanning Acoustic Microscope (SAM), and Optical microscopes), electrical bench verification tools and ATE datalog interpretations, circuit schematics interpretation, fault isolation techniques (such as Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), and die level microprobing), deliding/delayering techniques (such as chemical and laser decapsulation, chemical etch, dry etch, mechanical polishing, or combination of different etches), and SEM/EDX analysis.
Works with fellow engineers both local and other Failure Analysis engineering counterparts from different Microchip sites to develop failure analysis techniques and capabilities if needed.
Works with different cross-functional team such as FA counterparts, CQE, Quality, Reliability, Apps, Design, Foundry, Test and Product Engineering, Line Engineering and technicians, and Wafer fab as appropriate to resolve FA cases.
Works with external or 3rd party FA laboratory to utilize advanced FA technique capabilities needed for analysis.
Reviews assigned failure analysis case and request additional information if needed.
Ensures that historical data are reviewed for any relevant information that can be used for the analysis.
Performs and/or reviews initial analysis and define appropriate next analysis steps.
Provides regular FA updates and timeline to customer.
Ensures that FA reports are release on time based on target average cycle time.
Trains/Mentors/Assists new hires FA Engineers, technicians, and inspectors.
FA focal person responsible in advanced tools/equipment 5S and improvements and coordination with FAREL Equipment group for consumables & spare parts procurements, repair, and maintenance.
Generates comprehensive failure Analysis Report based on analysis findings.
Supports Environmental Management Systems and Quality Management Systems standards
Observe safety and housekeeping Clean as you go during day-to-day failure analysis activities.
Develops and implements new failure analysis methods.
Expert on at least 2 or more fields - either in a product device family, die, and package technologies.

Requirements/Qualifications:

Education Level

Preferably Graduate of Bachelor or Master in Electronics Engineering, Electrical Engineering, Physics with w/ a semiconductor bias.
Strong knowledge and experience in electronic /electrical circuit and material analysis.

Working experience

No experience required.

One (1 ) year relevant experience in a semiconductor or electronics manufacturing environment with work experience from Quality and Reliability, Failure Analysis, Product or Process Engineering is an advantage.

Other Requirements

Able to extract, analyze, and report data as necessary.
Computer literate (MS Word, PowerPoint, and Excel).
Able to communicate and coordinate throughout all levels and functions of the organization as a team player with little supervision.
Strong knowledge of tools and methods related to inspection and analysis of components of both package and die form in semiconductor industry environment.
Strong interpersonal and communication skills (verbal and written) with the capability to interface throughout all levels and functions.