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Responsibilities
Requirements
Job ID: 149118663
Skills:
Flip Chip Bonders, thermal modelling, Lamination Machine, calculation and measurement techniques, vision application, Design and Development of High-Speed Pick and Place Systems, Die Attach Machines, CAD Software
Skills:
3D CAD, Product Development, Tolerance Stack-up, 2D Engineering Drawings, Mechanical Design
Skills:
Automation Design, High-Speed Pick and Place mechanisms, 3D CAD software, Geometric Dimensioning Tolerancing, Equipment troubleshooting, High precision machine design
Skills:
simulations , Solidworks, Research And Development, CAD, Electronics, Tolerance, Fabrication, 3D, Semiconductor Industry, Layout, Project Management, Finite Element Analysis, design for manufacturing, Mechanical Engineering, Assembly
Skills:
Solidworks, Pro-e, Fmea, injection moulding processes, engineering plastics, Ug Nx, Creo, Autocad, mechanical design skills, 3D CAD design software
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