Job Description

Our client is a well-established research and technology organisation, focusing on advanced R&D and the development of next-generation semiconductor technologies.

We are looking for an Advanced Packaging & Process Integration Engineer to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.

Position: Advanced Packaging & Process Integration Engineer
Employment Type: Full Time, Permanent
Location: Singapore

Responsibilities:

Research and develop fine-pitch flip-chip and hybrid bonding technologies
Develop Chip-to-Wafer and Wafer-to-Wafer bonding processes
Support interposer and hybrid bond pad fabrication and process integration
Optimise bonding materials, surface preparation and process parameters
Conduct engineering experiments, process optimisation and data analysis
Improve process yield, performance and reliability
Support 2.5D / 3D heterogeneous integration technology development
Collaborate with internal teams and external partners on R&D projects

Requirements:

Bachelor's Degree in Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering or related discipline
1-6 years of relevant experience in microelectronics, semiconductor or component integration
Experience in advanced packaging / process integration is preferred
Hands-on experience in flip-chip bonding will be advantageous
Knowledge of hybrid bonding equipment and materials is advantageous
Experience in process development, data analysis and DOE preferred
Good analytical, problem-solving and communication skills

..Interested candidates, kindly email updated resume to [Confidential Information] with Subject of Advanced Packaging & Process Integration Engineer, thank you.