Data Analysis, Fmea, TSV-related integration, Spc, dielectric bonding, Disco platforms, 8D, EVG, hybrid bonding, Statistical Modeling, bonding process technologies, fault isolation techniques, Doe, TEL

Solidworks, Power Bi, Tableau, Python, Data Analysis, process integration optimization

Microsoft Office, device characterization, Process flow setup, Unit module process development, ET analysis, yield enhancement, Design rule generation, Process product qualification, ETOX Flash process, Electrical Test data Inline Analysis

Gcp, Linux, Terraform, PowerShell, Bash, Windows, Azure, Python, AWS

.NET, containerization , Git, PostgreSQL, Blazor, Devops Tools, Python