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Showing 3 jobs
Skills:
Die Visual, QFN process, Die Prep Operation, Backgrind, Pick and place, 6S activities, Wafer saw, Tape and Reel Process
Skills:
Wirebond, Reading Comprehension, FOL Die attach process, 6S activities, Basic computer math, QFN Operations
Skills:
Wirebond, Auto Die attach, Auto optical inspection machine
