Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our we affectionately refer to it as the and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

The Engineer I-Process - Backgrind is responsible for the development, characterization, qualification, and industrialization of wafer thinning technologies supporting advanced semiconductor packaging platforms including WLCSP, BGA, MDQFN, Fan-Out, and other wafer-level packaging technologies. The role focuses on developing robust backgrinding, wafer thinning, stress management, and wafer handling processes that enable high-yield, reliable, and manufacturable products.

The position serves as the technical lead for Backgrind process development activities, driving technology innovation, new product introduction (NPI), process optimization, and manufacturing readiness while collaborating with Product Development, R&D, Equipment Engineering, Operations, Quality, and external suppliers.

Job Responsibilities:

Lead the development and qualification of wafer backgrinding and thinning processes for new technology platforms and products.
Establish process architecture, process windows, and technology roadmaps for wafer thinning applications.
Drive innovation initiatives to enable thinner wafers, improved wafer integrity, and advanced package requirements.
Evaluate and implement new grinding technologies, materials, consumables, and equipment solutions.
Develop best practices and standards for wafer thinning and handling operations
Define process architecture, process flow, and critical process parameters to meet design, reliability, and manufacturability requirements.
Lead process characterization activities to establish robust operating windows and process margins.
Evaluate emerging technologies, materials, and equipment to enhance technical capabilities and competitive advantage.
Drive innovation initiatives to improve metallization performance, process capability, throughput, and cost effectiveness.
Lead process transfer from development to pilot and high-volume manufacturing.
Generate process specifications, control plans, operating procedures, and qualification reports.
Ensure developed processes meet manufacturability, reliability, and cost targets.
Support manufacturing teams during technology ramp and early production phases.
Drive process stabilization and continuous improvement following production release.
Serve as Subject Matter Expert (SME) for:

Requirements/Qualifications:

Bachelor's Degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, Related Engineering disciplines
Minimum 3 years of semiconductor manufacturing experience with direct experience in Backgrinding and Tape Lamination process
Engineering tools: Design of Experiment (DOE), Minitab or JMP, Statistical Process Control (SPC), FMEA, GRR and Six Sigma tools
Familiarity with process characterization, recipe creation, and equipment or process troubleshooting
Strong analytical and problem-solving skills ability to interpret SPC charts and process data.
Good communication skills and ability to work in a team-oriented environment.
Knowledge of safety protocols and cleanroom practices.
Strong experience with Fan-in and Fan-Out or advanced packaging tools is highly preferred
Proficiency in MS Office and maintenance management systems.
Strong analytical and problem-solving skills
Leadership and mentoring capability
Good communication and teamwork skills
High attention to detail and sense of accountability

Engineer I Process_Grinding and Lamination