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Singapore, Bendemeer

Skills:

HBM (High Bandwidth Memory), Wafer Probe Equipment, Mechanical stress analysis, design of experiments, Data Analysis, Project management, Electro-mechanical controls and components, Semiconductor device test methodology, Statistics, AI-assisted tools, Materials selection, Thermal systems, Probe Processes, Electrical circuits, 3D CAD software, Ms Office Products, Semiconductor processes, Machine Design

Early Applicant
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