Descum, Fmea, lithography, Spc, Ball drop process, Etching, Sputter, Jmp, APQP standard, Project Management Certification, WLCSP bumping process, 2P2M DOE, Plating

ocap, Process Engineering, NPI Program Management, Fmea, JMP analysis, Control Plan

Process yield improvement, Fmea, Spc, Experience in Process improvement, Process analytical skill, COPQ reduction, Six-sigma, Failure Analysis, Dfm