Microsoft Office, Excel, Word, Powerpoint, Process mechanical construction design, Project management techniques, Mechanical Engineering, Design Software

MATLAB, Python, LabVIEW, laser optics, Optical Power Meters, Optical Product Design, Optical Alignment, Zemax OpticStudio, Interferometers, Precision Translation Stages, Thin-Film Filters, Spectrometers, Fluorescence Detection, optical system design, Optical Simulation Software

MATLAB, Python, LabVIEW, Root Cause Analysis, laser optics, Optical Product Design, Optical DFMEA, Zemax OpticStudio, Thin-Film Filters, Fluorescence Detection, Optical Simulation Software, optical system design

power meters , alignment algorithms, fixture design, laser sources, Controllers, equipment control, optical active alignment, stages, MPO connectors, epoxy dispensing and curing, equipment buyoff and qualification, active alignment equipment

Design for Manufacture (DFM), Design of Experiments (DOE), New Product Introduction (NPI), Solidworks, Process control measures, Root Cause Analysis, Iso 14001, contamination control, Project management, Process development, Autocad, Lean Six Sigma, Laser safety risk assessments, Iso 9001, Commissioning test and metrology systems, Quality assurance systems, As9100, Fiber processing techniques, 8D problem-solving

material properties , plasma diagnostics , Iot, Electronic Circuits, System Design, Spectrum Analyzer, Edge safety, module integration, CVD technology applications, Network Analyzers, gas flow, transmission line theory, Mechatronics, RF Plasma tool development, analog and digital data acquisition controllers, vacuum systems, RF sensors, Plasma Probes, PLCs, RF power delivery, Mechanical Design, Amplifiers, impedance matching, RF Plasma arc detection

wafer assembly process, laser groove edge trimming, DBG or SDBG process, DOE matrix design, edge trimming process, back grinding, stealth dicing, dicing, Spc, lamination, wafer thinning, JMP data analysis, bumping flip-chip processes, laser cutting parameters, Si mold wafer backside grinding thinning process, lamination process, laser stealth dicing process, wafer grinding

New Product Introduction (NPI), Manufacturing scale-up, Root Cause Analysis, Lean Six Sigma methodologies, contamination control, Process Validation, Optical alignment, Process development, Laser systems, Optical fiber assembly

Microsoft Office, Excel, ACMV, Powerpoint