Metrology Tools Type Expertise in Thin Film Critical Dimension and Resistivity, Metrology Process, Technology Transfer Experiences with Fab-Specific Metrology Tools Measurement Systems and Applications, Quality Knowledge, Training Tools and Certification Example JMP FMEA DOE and 8D, SPC Knowledge

Technical Leadership, Emergency Response, Continuous Improvement, Incident Investigation, Process Hazard Analysis, Troubleshooting, Engineering Project Management

Operational Excellence, Root Cause Analysis, Fmea, Process Engineering, engineering design, Troubleshooting, Chemical Engineering, Hazop, Technical Support, Technology Evaluation, Natural Gas, Petrochemical

Setup, Process Engineering, Precision manufacturing techniques, Machine commissioning, Non-ferrous metal processing, Process data analysis

wafer assembly process, laser groove edge trimming, DBG or SDBG process, DOE matrix design, edge trimming process, back grinding, stealth dicing, dicing, Spc, lamination, wafer thinning, JMP data analysis, bumping flip-chip processes, laser cutting parameters, Si mold wafer backside grinding thinning process, lamination process, laser stealth dicing process, wafer grinding

Fmea, Spc, Doe, process engineering software systems, Mes

metallization , Statistical Analysis, Process Engineering, Root Cause Analysis, Process Control, Backfinish operations, Process troubleshooting

SAP, Non-Ferrous Metal Processing, Cold Rolling, Machine Commissioning, Process Engineering, Lean Manufacturing, Six Sigma, Process Control