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Job Description:

The Ball Attach Engineer I is responsible for supporting, establishing, and improving ball attach processes in PLP assembly operations. The role includes start-up/line ramp activities, including process recipe creation and sustaining production performance, driving yield improvement, and actively participating in. The position requires strong analytical capability, hands-on troubleshooting, and collaboration with cross-functional teams to ensure stable, efficient, and high-quality manufacturing operations.

Job Description:

Lead and support start-up of Ball attach line and new products
Establish initial process conditions and validate readiness for mass production
Monitor early production performance and stabilize process during ramp-up phase
Identify and mitigate start-up risks affecting yield, quality, and throughput
Monitor and maintain ball attach process parameters to ensure stability and consistency
Develop, define, and maintain ball attach process recipes (e.g., EFO settings, bonding force, ultrasonic power, time, temperature profiles)
Perform DOE (Design of Experiments) to determine optimal process windows
Continuously optimize recipes to improve yield, efficiency, and reliability
Standardize and release qualified recipes for production use
Ensure compliance with established process control plans and specifications
Perform regular process audits and line checks
Analyze yield trends and defect data (e.g., missing balls, ball bridging, ball deformation)
Identify root causes and implement corrective and preventive actions
Respond to production issues and equipment-related abnormalities
Conduct root cause analysis using standard methodologies (5 Whys, Fishbone, 8D)
Coordinate with Equipment, Quality, and Production teams for resolution
Participate in process improvement projects and cost reduction activities
Recommend and implement best practices for improved efficiency
Maintain and update process documentation including work instructions and SOPs
Ensure compliance with internal quality standards and audit requirements
Support internal and external Customer audits

Requirements/Qualifications:

Bachelor's Degree in Engineering (Electronics, Industrial, Mechanical, Chemical, or equivalent)
Minimum of 3 years experience in semiconductor specific to WLCSP or BGA process
Experience on handling Ball Attach, Ball Repair, Reflow, Flux rinse and Shear process
Working knowledge of SPC, MSA/GR&R, DOE, PFMEA, and problem-solving methodologies.
Strong analytical and problem-solving skills ability to interpret SPC charts and process data.
Good communication skills and ability to work in a team-oriented environment.
Knowledge of safety protocols and cleanroom practices.
Strong experience with WLCSP or advanced packaging tools is highly preferred
Proficiency in MS Office and maintenance management systems.
Strong analytical and problem-solving skills
Leadership and mentoring capability
Good communication and teamwork skills
High attention to detail and sense of accountability

Engineer I -Process (Ball Attach)