Fmea, Descum, Spc, lithography, Ball drop process, Etching, Sputter, Jmp, WLCSP bumping process, Plating, APQP standard, Project Management Certification, 2P2M DOE, Bumping process knowledge

ocap, Process Engineering, NPI Program Management, Fmea, JMP analysis, Control Plan

Process yield improvement, Fmea, Spc, Experience in Process improvement, Process analytical skill, COPQ reduction, Six-sigma, Failure Analysis, Dfm