3d packaging , process qualification , thermal management , Package Warpage, 2.5D Packaging, Spc, CoPoS, Flip Chip Assembly, Manufacturing Engineering, Failure Analysis, HBM Packaging, Yield Improvement, Reliability Testing, CoWoS, Equipment Qualification, Hybrid Bonding, Large Die Packaging, Alignment Accuracy, Chiplet Integration, Thermo Compression Bonding, Doe, Customer Process Development

modal testing , Javascript, Python, Fea, motion optimization techniques, system dynamics, high-performance feedback systems, vibration modelling, linear rotary actuators, high-resolution encoders, servo tuning, trajectory planning, vision motion synchronization, PID control, Simulation Tools, laser interferometers, isolation system design, structural dynamics analysis, motion controllers, motion architecture, direct-drive motors, feedback systems, noise cancellation strategies, stiffness tuning, capacitive sensors, Encoders, real-time control integration

Regression Analysis, Continuous Integration, Agile Development, Python Programming, NAND flash operation, SSD firmware testing, firmware verification planning, SSD firmware components, SSD system-level debugging, test coverage analysis, branch management, Automated build, test development automation, test automation systems, Git development flow, Reporting