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Job Description:

Engineering manager to lead the development of panel level packaging in the Microchip Philippines site.

Identify suitable Panel Level and WLCSP (PLP) package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with material suppliers as well as design groups, product engineering, marketing and business units

Manage qualification of new packages or changes to ensure quality and mitigate risk
Initiate or assist with documentation creation, specifications and build instructions for PLP assembly
Assist with global cost reduction, standardization and new system implementation projects
Initiate and develop FMEA and other proactive reliability and process improvement flows

Requirements/Qualifications:

Education

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience:

At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)

Prior exposure and work in a high-volume IC assembly production/factory is preferred

Preferred Skills

CAD software use (e.g. AutoCAD and Cadence APD)
FEA modeling experience for thermal, mechanical and electrical package optimization
Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
Experience in strip testable package development

R&D Development Manager

R&D Development Manager