Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our we affectionately refer to it as the and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

Panel Level Package Development Engineer

Responsible for leading R&D activities focused on the development, qualification and deployment of new materials, processes, products and manufacturing technologies to support business and technology roadmap objectives. The role drives technical evaluations, design reviews, process characterization, risk assessments and validation activities to ensure successful implementation of development projects. In addition, position supports MES configuration, lot kitting, wafer verification and lot release activities to ensure accurate product setup and smooth production execution. The position works closely with cross-functional teams to support new product introduction, continuous improvement and operation excellence.

Requirements/Qualifications:

Education

Minimum diploma in Electronics Engineering, Electrical Engineering, Mechatronics, Industrial Technology, or related field (Engineering Degree)

Work Experience:

At least 5 years of IC packaging engineering experience
Prior exposure and work in a high-volume IC assemble production/factory is preferred

Engineer II-Packaging