Are you looking for a unique opportunity to be a part of something great Want to join a 17,000-member team that works on the technology that powers the world around us Looking for an atmosphere of trust, empowerment, respect, diversity, and communication How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization We offer all that and more at Microchip Technology Inc.

People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our we affectionately refer to it as the and it's won us countless awards for diversity and workplace excellence.

Our company is built by dedicated team players who love to challenge the status quo we did not achieve record revenue and over without a great team dedicated to empowering innovation. People like you.

Visit our page to see what exciting opportunities and company await!

Job Description:

This position is for an R&D and NPI engineering manager to support Panel Level Package development in Microchip's Philippine factory

Requirements/Qualifications:

Education

BS degree in Electrical, Material, Mechanical engineering or other equivalent engineering field

Work Experience:

At least 8 years of direct or managed IC packaging engineering experience including advanced pkg development (WLCSP, stacked die, laminate and lead frame packages)
Prior exposure and work in a high-volume IC assembly production/factory is preferred

Preferred Skills

CAD software use (e.g. AutoCAD and Cadence APD)
FEA modeling experience for thermal, mechanical and electrical package optimization
Advanced package development knowledge including WLCSP, Cu pillar bump, SiP packaging, and Cu Clip assembly
Experience in strip-testable package development

R&D Development Manager