Flip Chip Bonders, thermal modelling, Lamination Machine, calculation and measurement techniques, vision application, Design and Development of High-Speed Pick and Place Systems, Die Attach Machines, CAD Software

servo axis, pneumatic motor, EPDM, Robotics, SolidWorks 3D, Sensor, BOM preparation using SAP

Solidworks, DFA, Fea, mechanism design, power transmission systems, cams, Motors, Dfm, Clutches, Dfmea, Doe, linkages, Six Sigma, Gears

MATLAB, FEA analysis, electromechanical components, Minitab, Creo, Adams, Simulink, Autocad, Eplan

iso standards, manufacturing practices, Fmea, Geometrical tolerance and dimensional analysis, FEA simulation, Engineering material selection, Sensors, Ultra high precision machine design, pneumatic system, 3D solid Modeling, mechanical components, high speed pick and place mechanism design, Doe, Structural kinematics and dynamic analysis, servo system, Design troubleshooting

simulations , Solidworks, Research And Development, CAD, Electronics, Tolerance, Fabrication, 3D, Semiconductor Industry, Layout, Project Management, Finite Element Analysis, design for manufacturing, Mechanical Engineering, Assembly

Automation Design, High-Speed Pick and Place mechanisms, 3D CAD software, Geometric Dimensioning Tolerancing, Equipment troubleshooting, High precision machine design