high power scope, Die Visual, Tape and Reel, low power scope, Backgrind, Die Prep Operation, Pick and place, Basic Mathematical skills for yield computations, Wafer saw, Basic computer knowledge in Excel, Visual Inspection

Wirebond, High Power Scope, Visual Inspection, FOL Die attach process, Basic Mathematical skills for yield computations, Low Power Scope, Basic computer knowledge in Excel, Mold Package saw, QFN Operations

PCBA handling procedures, De soldering, Electronics board troubleshooting, Hardware software validation and verification, Troubleshooting, Visual Inspection, Repair